四层BGA蓝油沉金板
八层BGA蓝油沉金板
层数：8，
材料：FR4，TG170，板厚：1.6mm，
铜厚：内外层 1oz，蓝色阻焊，白色字符。
表面处理：沉金 3u"+电金手指30U"
外层线宽/线距：4/4mil
内层线宽/线距：3.5/3.5mil
最小孔径：0.25mm
应用行业：消费电子
应用产品：固态硬盘
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PCB Manufacturing Capacity:
►Base material: FR-4｜High Tg｜CEM-1｜CEM3｜Halogen-free｜PTFE｜Teflon｜Aluminum｜Copper｜Ceramic PCB｜Polyimide｜FR-5,etc......
► PCBs: Rigid (1-64 Layers), Flexible (1-10 Layers), Rigid-flex (2-20 Layers), Flex (1-8 Layers), MCPCB (Aluminum and Copper 1-4 Layers)
► Board thickness: 0.2mm–10mm
► Copper thickness: 0.25 oz -12 oz
► Usual Panel Size: 500 mm × 880 mm (For 1~64 Layer PCB)
► Max Panel Size: 1500 mm × 560 mm (For 1~2 Layer PCB)
► Min. Hole Size: 0.075mm (3mil)
► Min. Line Width/Spacing: 3mil
► Surface Finishing: HASL / HAL, HASL Lead Free, ENIG, Immersion silver, Immersion tin, OSP, Plating Hard Gold, etc......
► Solder Mask Color: White, Black, Yellow, Green, Blue, Red, Purple ,etc......
► Silkscreen Color: Black, White, Yellow, Red, Blue, etc......
► Special Process: Buried hole, Blind hole, Soldermask ink, Epoxy resin, Copper, Embedded Resistance, ► Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling and impedance control.
PCB Assembly Capacity:
► SMT Capability: 5KK points/Day, single-sided / double-sided, 10 Lines
► Reject rate of components: 0.3% (Capacitor and Resistance) No (IC)
► Min. Package: 01005 chip / 0.35 Pitch BGA
► Min. Precision: +/-0.04mm
► Min. Precison of IC: +/-0.03mm
► SMD Size: 0201-150mm
► Max. Height of components by machine: 30mm
► Min. Pin pitch of SMT: 0.2mm
► Min. Ball pitch of SMT: 0.2mm
► Min. Precision of Stencil: 5um
► PCB Size of Assembly: 5×5mm-500×1500mm
► PCB Thickness of Assembly: 0.1-10mm
► BGA/μBGA: Available; Solder paste / glue processing
► DIP capacity: 0.30 million points per day
► Max. Capability: Stable support for 200 products on production line at the same time
► Functional testing & Casing assembly: Upon customer’s requirements
Full Range Of Testing Services:
► AOI
► Function testing
► In circuit testing
► X-ray for BGA testing
► 3D paste thickness test
► Flash testing and earth bonding tests can also be undertaken where required
Using our X-ray machine, we test PCBs to component level and all wiring is fully inspected and tested
Advantages:
► No MOQ
► 20 years of PCB & PCBA turnkey services
► Quick turn, Prototype, Low & medium & high volume
► Components sourcing,ODM&OEM services provide
► ISO 9001-2015, ISO14001-2015, ISO/TS16949, ISO13485, IATF16949, OHSAS18001 certified, UL E352816
► 100% E-test,100% visual inspection, including IQC, IPQC, FQC and OQC
► 100% AOI inspection, including X-ray, 3D microscope and ICT
► Fast response within 24 hours, great pre-sales, sales, after-sales
► All kinds of Export / Import Processing Support, EX-Factory, FOB HK, FOB Shenzhen, FCA HK, FCA Shenzhen and DDU by express
► All kinds of payment: T/T
► Guarantee Sales Service, for all problems encountered kindly contact us, we will do the after service any time.