|
No
|
Item
|
Process capability parameter
|
|
1
|
Base material
|
FR-4 (Usual TG130/TG135/TG140)｜High Tg (TG150/TG170/TG180...)｜Halogen-free｜PTFE｜Polyimide｜Aluminum/Copper/Ceramic Based ｜FR-1 / CEM-1 OR 3 / XPC｜
|
|
2
|
PCB Type
|
PCB｜FPC｜R-FPC｜HDI｜MCPCB｜BT
|
|
3
|
Max Layer counts
|
64 Layers
|
|
4 |
Min~Max Finished Board Thickness |
0.1-10mm |
|
5 |
Max Finished PCB Size |
1200 × 650mm
(FR4 & Aluminum LED Long Board for 1~2L PCB Max Size: 1500×500mm)
|
|
6
|
Min base copper thickness
|
1/3 oz （12um）
|
|
7
|
Max finished copper thickness
|
12 oz
|
|
8
|
Min Line trace width / spacing
|
InnerLayer
|
2/2mil （H/H oz base copper）
|
|
9
|
OuterLayer
|
2.5/2.5mil （H/H oz base copper）
|
|
10
|
Min spacing between hole to inner layer conductor
|
6mil
|
|
11
|
Min spacing between hole to outer layer conductor
|
6mil
|
|
12
|
Min annular ring for via
|
3mil
|
|
13
|
Min annular ring for component hole
|
5mil
|
|
14
|
Min BGA diameter
|
8mil
|
|
15
|
Min BGA pitch
|
0.4mm
|
|
16
|
Min hole size
|
0.15mm（CNC）｜0.1mm（Laser）
|
|
17
|
Max aspect ratios
|
20:1
|
|
18
|
Min soldermask bridge width
|
3mil
|
|
19
|
Soldermask / Circuit processing method
|
Film｜LDI
|
|
20
|
Min thickness for insulating layer
|
2mil
|
|
21
|
HDI & Special Type PCB）
|
HDI（1-5 steps）｜R-FPC（2-20layers）｜High frequency mix-pressing（2-14 layers）｜Buried capacitance & resistance …
|
|
22
|
Surface treatment type
|
ENIG｜HAL｜HAL lead free｜OSP｜Immersion Sn(/Tin)｜Immersion silver｜Plating hard gold｜Plating silver
|