Details：
Production Capabilities (FPC):
1.Material: Polyimide，Polyester
2.Layer Counts: 1-6L
3.Min Line Width/Space: 3/3mil
4.Max Board size: 500*500mm
5.Drilling diameter:0.25mm-6.5mm
6.Base material copper thickness: 12um-70um
7.Insulate layer thickness: 0.0125-0.05mm (PI thickness)
8.Electronic plating Sn/Pb thickness: 3μm --- 20μm
9.Electronic plating Au thickness: ≥0.05μm
10.Chemical immersion Ni/Au thickness: 0.05μm --- 0.1μm
11.Electronic plating Sn thickness: 3μm --- 20μm
12.Etching width/space: S: 3.5mil (0.076mm),D、F、M: 4.5mil (0.100mm)
13.Etching tolerance: width ±20﹪ (special ±10﹪)
14.Board Outline tolerance: ±0.1mm, ±0.05mm（the same mould）
15.Parts fixed position tolerance: ±0.2mm
16.Insulation Resistance: 1011Ω（Normal）
17.Thermal Shock Resistance: 260℃ 10 seconds
18.Peel Off Strength: >1.0N/mm
19.Inspection Standard: IPC-A-600F